Our surface treatment processes enjoy a high reputation among our customers.

We have started "Under Bump Metallurgy (UBM) formation service" using electroless plating process, unique to us. The service can be applied to wafers larger than 4 to 12 inches in diameter and pads made of aluminum alloys, copper, and other materials. Also, the service, leveraging our electroless plating technology, realizes much simpler UBM formation process, in comparison with such conventional methods as electrolytic plating or sputtering. The simplicity stably results in lower production costs and quicker delivery time.

Based on our core competence such as "organic synthesis", "purification technology", "surface treatment technology", "analytical technology" and "mixing and blending skills", we are developing and supplying high quality surface treatment agents. The agents are used in a wide range of electronic components including lead frames, connectors, or printed wiring boards, and highly acclaimed by customers.

UPINORG (high-purity copper sulfate) of JX Nippon Mining & Metals has an excellent reputation in a wide range of production fields.

Our UPINORG (high-purity copper sulfate), produced from electrolytic copper and purified sulfuric acid, is used for high-quality plating electrolyte, catalysts and high-purity reagents. Our UPINORG is available in the form of powdered crystal as well as solution.